Metallized ceramic boards are an ideal base for production of multi-chip modules. Thick-film technology allows the formation of structures for both direct chip mounting with subsequent microwire bonding, and for flip-chip mounting. The chip can be mounted both by soldering and by gluing to dielectric or electrically conductive glue. Our company is ready to provide a full production cycle of multi-chip modules according to the design documentation of the customer or on the basis of technical specifications.
