Conductor pastes are the basis for production of conductor structures, they consist of fine metal powders (silver, platinum, gold, palladium and their alloys) and glass frits (powder) dispersed (mixed) in organic binders and plasticizers.
Fine powders are made by grinding original metals or alloys and glass in ball mills. Organic binders and plasticizers are refined products or natural substances.
The pastes contain from 75 to 95 percent of solids, the rest are organic binders. In the total solids content, the ratio of the proportion of metal to the proportion of glass frit is on average 9: 1.
During application, the paste undergoes high-temperature processing at temperatures from 600 to 900 0C. In this case, the organic binders are burned out, and the glass powder melts and fixes the metal powder on the surface of the hybrid integrated circuit. The main parameter of the conductor structures is the resistivity after firing. The table below shows all the basic characteristics of the conductor structures.