Reengineering and custom solutions

Development of electronic devices is on the way to reducing sizes and increasing the density of electric current. This in turn results in an increase in the operating temperature of the device, which necessitates an increase in reliability to ensure the required service life. To meet these challenges, it is necessary to create new technological processes using advanced materials.

Thick-film technology has become a real alternative to the standard technology for assembling electronic devices using boards based on fiberglass laminate, especially to meet the challenges. Our technology helps you to be ready for the electronics industry of the future.

World experience in the use of products made by thick-film technology suggests that its advantages are most in demand in medical and industrial electronics, automotive and telecommunications, commercial, consumer and aerospace electronics and electrical engineering. Fokon LLC. products are the right choice for you.

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