Boards for power and microwave electronics

Power electronics designers are constantly getting new challenges. Requirements for increasing specific power, operating temperatures, frequency range and miniaturization are expanding. Classical devices built on the basis of fiberglass are gradually being replaced by modern ceramic-based products, which can meet necessary requirements.

The use of ceramic-based boards expands the possibilities of creating power electronic devices with unique operational characteristics due to the most effective thermal properties of the ceramic board. Fokon LLC. offers its customers competencies in both R&D and the possibility of contract manufacturing of circuit boards for power electronics, certified according to the ISO 9001:2015 system. The materials used by us comply with the RoHS / CE directives and allow working with both alumina and aluminum nitride ceramics

Фокон

Parameter	Value
Application	Power and microwave electronics
Substrate material	Al₂O₃ or AlN ceramics
Thickness of ceramic substrate, mm	0,15…2,0
Size of substrate, mm	From 2х2 до 100х100
Metallization type	Single-sided, two-sided and plated-through holes
Conductor thickness, microns	From 20
Standard conductors	Ag, AgPd, AgPt, Au, AgCu and Сu – upon requestу
Conductor thickness after firing, microns	5…200
Conductor resistivity, Ω/£	0,005….0,050
Standard resistors	RuO₂
Resistor resistivity, Ω/£	1….10⁶
Resistor accuracy after firing, %	±5
TCR ppm/K	±50…±300
Contacting	Pressed contacts, soldering, bonding

Microwave electronics is classically built on boards with thin-film conductive elements, which is a limiting factor both in terms of cost of products and in terms of mass production. Advanced thick-film materials make it possible to obtain conductor structures operating efficiently at frequencies of several tens of gigahertz. The use of high-frequency ceramics of the polycor type in thick-film technology allows to achieve results similar to those for thin-film structures.

Thick-film technology development throughout its entire existence took the way of increasing print resolution. The classic technology allows to get prints with a resolution of 0.1 mm without serious difficulties. However, a further increase in resolution is faced with insurmountable obstacles, primarily determined by the presence of a grid. Through the use of photodeveloped pastes, it was possible to solve this problem as well. The table shows the results achieved.

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