Characteristics of dielectric structures

Not only conductor pastes are the basis for production of single-layer and multi-layer conductor structures, consisting of fine metal powders, but also dielectric and overglaze pastes which consist of fine glass powder (frit glass), dispersed in organic binders and plasticizers.

Fine powders of glass are made by grinding original glass in ball mills.

Величина пробивного напряжения, В Up to 2000
Breakdown voltage, V
Coating integrity
Resistivity to heating during soldering
Minimum print width, microns
200 (100 upon request)
Minimum gap width between prints, microns
200 (100 upon request)
Minimum print thickness, microns
Maximum print thickness, microns
200 (300 upon request)
Print color after firing
Transparent, green, blue, black 

Organic binders and plasticizers are refined products or natural substances.
The paste contains from 75 to 95 percent of solids, the rest are organic binders.
During application, the paste undergoes high-temperature processing at temperatures from 500 to 900 0C. In this case, the organic binders are burned out, and the glass powder melts and covers the required surfce, performing the function of either protective overlayer against environmental exposure or interlayer dielectric.
The main parameter of dielectric structures is the breakdown voltage after firing and coating integrity. The table below shows all the basic characteristics of the dielectric structures.

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