Standard structural components are often used in the development of hybrid integrated circuits. Advanced thick-film materials allow to implement a wide range of topological structures, which in turn provide a solution to almost any design idea.
The ability to metallize and fill holes with a conductor, providing breakdown voltages in the interlayer insulator in a wide range of values, creation of specialized coatings for solving assembly problems, production of precision resistors and many other possibilities - this is the potential of modern thick-film technology.
Single-sided boards of hybrid integrated circuits produced by thick-film technology are the first level of complexity. Such boards allow to implement simple electronic components or can provide circuitry with a solid-state IC with the subsequent possibility of sealing in the package. Such boards also allow to implement complex systems with multiple solid-state circuits on one board. In this case, the thick-film technology allows for the implementation of chip interconnections and circuitry.
Two-sided and multi-layer boards of hybrid integrated circuits with metallized holes have found wide application both for creating 3-D systems and multi-chip modules, such microelectronic systems are the most complex embodiment of thick-film technology. In this case, thick-film technology allows for multi-level chip interconnections and circuitry using both direct chip mounting and flip-chip in one system.