Resistive pastes are the basis for production of resistive structures, they consist of fine powders of ruthenium oxide (and other metals) and glass frit (powder) dispersed (mixed) in organic binders and plasticizers.
Organic binders and plasticizers are refined products or natural substances.
The paste contains from 75 to 95 percent of solids, the rest is organic binders. In the total solids content, the ratio of the proportion of ruthenium oxide to the proportion of glass frit is on average 9: 1.
During application the paste undergoes high-temperature processing at temperatures from 500 to 900 0C. In this case, the organic binders are burned out, and the glass powder melts and fixes the ruthenium oxide powder on the surface of the hybrid integrated circuit. The table below shows all the basic characteristics of the resistive structures.
