Sealing of hybrid integrated circuits can be implemented in several ways. The classic option is the use of metal-glass or metal-ceramic packages. Preference is given to the first option because of the greatest reliability. In the low-cost version of integrated circuits, sealing is used with various sealants and compounds.
A remarkable feature of hybrid integrated circuits or modules is that such a circuit can be a complete product with its own functionality. In this case, to achieve the goals of miniaturization, sealing can be provided by the functional package of the product.
